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Pitch 0.2mm Hot Bar Soldering Machine , 0.8Mpa SMT Assembly Equipment

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Winsmart Electronic Co.,Ltd
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City:huizhou
Province/State:guangdong
Country/Region:china
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Pitch 0.2mm Hot Bar Soldering Machine , 0.8Mpa SMT Assembly Equipment

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Brand Name :Winsmart
Model Number :SMTS32
Certification :CE
Place of Origin :China
MOQ :1 set
Price :USD1-10000/Set
Payment Terms :L/C, T/T, Western Union
Supply Ability :200 sets per month
Delivery Time :5-8 days
Packaging Details :Plywood case
Usage :Welding
Weight :62kgs
Voltage :220V/110V
Temperature Accuracy :±2°C
After-sale service :Engineers available to service machinery overseas
Name :PCB Bonding Machine
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SMT Assembly Equipment PCB Bonding Machine PCB Soldering Machine

PCB Bonding Machine Applicable Area:

LCD Module, Solar Battery, Camera , Electronic Components, Coil / Inductor, Mobile Devices, PWB, Power Devices.

All where there need to be heated or fusing or joining or forming.

PCB Bonding Machine Features:

1. Unique pulse heat technology provides fastest soldering head heating.

2. Programmable soldering temperature, heat-up rate and time duration for a wide range of products.

3. Thermocouple is fixed in close proximity to the working surface & the thermode, thus providing accurate temperature feedback control.

4. Closed Loop PID temperature control with clearly visible LED display.

5. Soldering time can be programmable and is triggered by temperature.

6. Floating thermode ensures consistent pressure and heat transfer between the thermode head and the parts to be joined.

7. Programmable pressure switch with LCD display for precise force control.

8. CCD camera system with magnification lens can be retrofitted for fine-pitch positioning.

PCB Bonding Machine Specification:

Machine size 610×410×450mm
Working area Max 150*150mm
Machine weight 62Kg
Working air pressure 0.6-0.8Mpa
Fixture quantity 2
Thermode head size Max 40*3mm
Welding precision pitch 0.2mm
Pressing time 1~99.9s
Temperature settings RT~500℃ tolerance ±5℃
Welding pressure 1~20Kg
Temperature settings Two
Working environment 10-60℃,40%-95%
Power supply AC220V±10% 50HZ,2200W
Alignment mode CCD + LCD Monitor
Feeding mode Manual
Starting mode Press start button
Rotation Platform Cylinder control,tolerance<0.02mm

Customers' Applications:

Pitch 0.2mm Hot Bar Soldering Machine , 0.8Mpa SMT Assembly Equipment

Heat Bonding Paratmeter:

Temperature range 50℃ to 500℃
Temperature accuracy ±1°C
Bond timer 0-12 seconds
Bond air pressure 0.4-0.6MPa
Pressure accuracy ±0.05MPa
Max bond force 1100N

Our Advantages:

Our machine is completed with fine finishing in accordance with the quality standards of the industry.
Our strict quality management system maintains the excellent performance and quality of our products.
The product is the preferred one in the fields for its huge economic benefits.

Delivery Terms:

1. Ex-work/FOB/CIF/DDU, up to clients

2. Production leadtime: 7-15 days to customized make fixtures/jigs and test it with the punching machine.

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