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15W UV Laser Depanelizer Machine For 600x600mm Printed Circuit Board
Laser Depanelizer Advantages:
1. The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account by adapting the processing parameters and laser paths. There is also no need to factor in retooling times during a change of production.
2. No appreciable mechanical or thermal stresses occur. The ablation products are extracted by suction directly at the cutting channel. Even sensitive substrates can thus be precisely processed.
3. The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
The system software differentiates between production and set up processes which drastically reduces instances of faulty operation.
Laser Depanelizer Specification:
| Laser | Q-Switched diode-pumped all solid-state UV laser |
| Laser Wavelength | 355nm |
| Laser Source | Optowave UV 15W@30KHz |
| Positioning Precision of Worktable of Linear Motor | ±2μm |
| Repetition Precision of Worktable of Linear Motor | ±1μm |
| Effective Working Field | 600mmx600mm(Customizable) |
| Scanning Speed | 2500mm/s (max) |
| Working field | 40mmх40mm |
Laser Depanelizer Clean and Precise Cutting:
Lasers make clean, burr-free and precise cuts against the edge of circuits and other important components—improving overall design flexibility without damaging the substrate. Because you don’t have to reorder parts or sharpen bits and blade, laser systems are also more cost effective.
Laser Depanelizer Display:
Laser Depanelizer Application: