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UV PCB Laser Depaneling Machine Precision Laser Cutting For Rigid Boards
Introduction:
This PCB Laser Depaneling equipment is integrated with high-stability and the best performance UV laser
generator.
This equipment delivers great working area focus, power distribution ratio and small thermal affection that gives small cutting width and high cutting quality during processing.
With sophisticated two-axis table and closed loop control module, it ensures fast cutting while maintaining micron magnitude of precision with modern technology of position sensors and CCD image capture application.
As boards become thinner, smaller and more sophisticated, these methods expose PCB parts to mechanical stress—resulting in board breakage and lowering throughput.
Traditional Depaneling Solution Disadvantages:
1. Lower quality of cuts
2. PCB damage due to accumulated debris
3. Constant need for new bits, dies and blades
4. Not useful for boards < 500 µ
5. Design limitation—inability to cut complex, multidimensional PCBs
Clean and Precise Cutting:
Lasers make clean, burr-free and precise cuts against the edge of circuits and other important components—improving overall design flexibility without damaging the substrate. Because you don’t have to reorder parts or sharpen bits and blade, laser systems are also more cost effective.
Specification:
| Laser | Q-Switched diode-pumped all solid-state UV laser |
| Laser Wavelength | 355nm |
| Laser Source | Optowave UV 15W@30KHz |
| Positioning Precision of Worktable of Linear Motor | ±2μm |
| Repetition Precision of Worktable of Linear Motor | ±1μm |
| Effective Working Field | 460mmx460mm(Customizable) |
| Scanning Speed | 2500mm/s (max) |
| Working field | 40mmх40mm |
Details:
