Non Contact Automatic Laser Depaneling Machine 355nm 2500mm/s Scanning Speed

Non-contact Depaneling Method Automatic Laser Depaneling System

Automatic Laser Depaneling Introduction:

No mechanical dies or blades are needed for laser depaneling, which is completely software-controlled.

Any shape path, including curves and sharp corners, can be completed with this method, which also provides an unparalleled space advantage.

Automatic Laser Depaneling Offers all of the following benefits:

Temperature: A knowledgeable and experienced operator can select the optimum settings to guarantee a clean cut with no burn marks. Material type, thickness, and condition are all factors that will be considered and will determine the speed (and consequently will affect the temperature) of the laser.

Expelled Material: An exhaust or filter system removes any expelled material during the laser process. If the application does produce an extremely small particle residue, compressed air or a smooth tissue can be used.

Stress: Since there is no contact with the panel during cutting, lasers allow all most or all depaneling to be done after assembly and soldering. This allows for the avoidance of any bending or pulling of the board and therefore no stress is applied and no damage occurs.

Why Choose Automatic Laser Depaneling System?

Tooling expenses and expansive fixtures for die-cutting and other conventional methods is eliminated with Laser depaneling.

Laser depaneling is done with speed, pin-point accuracy, no tooling cost or wear, no part induced stress, and no cutting oils or other waste. A no-touch depaneling method using lasers provides a highly precise singulation without any risk of harming material, regardless of substrate.

The technology also works in the optimum pulse duration range for printed circuit board material processing. This pulse range plays a key role in processing efficiency and leads to lower cost and maximum use of processing time.

An exhaust or filter system removes any expelled material during the laser process.

If the application does produce an extremely small particle residue, compressed air or a smooth tissue can be used.

Automatic Laser Depaneling Features:

1. No mechanical stress

2. Lower tooling costs

3. Higher quality of cuts

4. No consumables

5. Design versatility-simple software changes enable application changes

Automatic Laser Depaneling Specification:

Automatic Laser Depaneling Cutting Result:

Automatic Laser Depaneling Applications:

Depaneling flex and rigid PCBs

Cover layer cutting

Cutting fired and unfired ceramics

PCB engraving