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Non-contact Laser PCB Cutting Machine Circuit Board Laser Depaneling Machine
Laser Depaneling Machine Introduction:
Laser cutting is not being offered as an additional method by some manufacturers.
UV laser depaneling makes use of a 355 nm wavelength, diode-pumped laser source.
The laser beam capable of cut widths under 25um, is controlled by high prceision mirrors.
Laser cutting has advantages of accuracy, precison, low mechanical stress and cut capabilities.
Laser Depaneling Machine Features:
No mechanical stress
Lower tooling costs
Higher quality of cuts
No consumables
Design versatility-simple software changes enable application changes
Works with any surface-Teflon, ceramic, aluminum, brass and copper
Fiducial recognition achieves precise, clean cuts
Laser Depaneling Machine Specification:
| Laser | Q-Switched diode-pumped all solid-state UV laser |
| Laser Wavelength | 355nm |
| Laser Source | Optowave UV 15W@30KHz |
| Positioning Precision of Worktable of Linear Motor | ±2μm |
| Repetition Precision of Worktable of Linear Motor | ±1μm |
| Effective Working Field | 600mmx600mm(Customizable) |
| Scanning Speed | 2500mm/s (max) |
| Working field | 40mmх40mm |