Winsmart Electronic Co.,Ltd
Call us +86 13829839112 Focusing on innovation for PCB automation!
Add to Cart
300x300mm 25W UV Laser PCB Depaneling Machine Without Cutting Stress and Dust
25W UV Laser PCB Depaneling Machine Applications:
It is widely used in Flex PCB and rigid PCB manufacturing.
25W UV Laser PCB Depaneling Machine Features:
1. Achieves ±20 µm cutting accuracy for complex PCB designs.
2. Eliminates mechanical stress, preventing cracks and delamination.
3. UV laser produces minimal thermal damage, protecting components.
4. Works with FR4, polyimide, ceramics, and rigid-flex PCBs.
5. No mechanical burrs, reducing post-processing requirements.
6. Creates precise micro-holes for high-density interconnects (HDI).
7. Can be integrated into SMT lines or used as a standalone machine.
8. No wear-and-tear cutting tools like router bits or blades.
25W UV Laser PCB Depaneling Machine Specifications:
| Model | SMTL300, dual tables |
| Power | 380V AC, 50Hz, 20A |
| Compressed Air | Compressed air |
| Machine Dimension | 1450(L)x1350(W)x1665(H)mm |
| Installation Space | 3000x3000x2500mm |
| Machine Weight | 800kgs |
| Ambient Temperature | 22 ~ 25 ℃ |
| temperature variation | within ± 1 ℃ / 24hr |
| ambient humidity | within 40% ~ 70% (no obvious condensation is allowed) |
| Dust free grade | 100000 or better |
| power consumption | 6KW |
| Cutting width | ≤ 50mm × 50mm |
| Cutting materials | full cut / half cut of PCB / FPC, LCP / glue and other related materials |
| Cutting thickness | ≤ 3mm |
| Cutting speed | ≤ 3000mm / S |
| Overall machining accuracy | ≤ 30um |
| Processing pattern | straight line, slash, curve, abnormity, etc |
| Laser | 355nm light wave nanosecond laser |
| Repetition frequency | 50-150khz |
| Laser Power | UV 15W@30KHz |
| Pulse width | < 20ns |
| Energy stability | < 3% RMS over 8hours |
| Beam quality m ² | < 1.3 |
| Mode | 2500mm/S |
| Warranty | 1 year |
| Service | Oversea training is available |
25W UV Laser PCB Depaneling Machine Advantages:
25W UV Laser PCB Depaneling Machine is a high-precision, non-contact depaneling solution designed for cutting, drilling, and marking printed circuit boards (PCBs). It is widely used in electronics, medical devices, automotive, aerospace, and telecommunications industries where high precision and minimal stress are required.
It is used in PCB depaneling due to its short wavelength (355nm) and high absorption efficiency in PCB materials like FR4, polyimide, ceramics, and aluminum-backed substrates. This ensures clean, precise cuts with minimal thermal impact.